FABRICATING METHOD OF PRINTED CIRCUIT BOARD USING THE CARRIER

摘要

A method for fabricating a printed circuit board using a carrier is provided to reduce a manufacturing cost of a printed circuit board by using a carrier permanently. A method for fabricating a printed circuit board using a carrier includes the steps of: preparing a carrier(20) having a fixing jig(16) of a pillar shape coupled to a connection unit, and a jig body having the connection unit on a dummy region; stacking a metal plate on the jig body, and connecting the fixing jig to the connection unit and the metal plate of the dummy region so that a surface of the metal plate is flat; stacking a first copper plating on the metal plate, removing the first copper plating layer of the remnant part except the first circuit pattern part, and forming the first circuit pattern on the circuit region; stacking the insulation layer on the metal plate so that the first circuit pattern is buried; forming a second copper plating layer on the insulation layer and a via-hole inner wall after forming the via-hole on the insulation layer; removing the second copper plating layer of the remnant part except a second circuit pattern part, and forming the second circuit pattern on the circuit region; separating the jig body from the metal plate by separating the fixing jig from the connection unit; and cutting the metal plate of the dummy region and removing the metal plate.