发明名称 Platen assembly, apparatus having the platen assembly and method of polishing a wafer using the platen assembly
摘要 In a platen assembly for a polishing apparatus, a platen supports a polishing belt that makes contact with an object during a polishing process, so that the platen provides a pressure on the polishing belt during the polishing process. A plurality of first bladders extends in a first direction on an entire surface of the platen and is spaced apart by a uniform distance, and the first bladders apply pressure to the polishing belt. A plurality of second bladders extends in the first direction on a middle portion of the surface of the platen between a central portion and a peripheral portion of the platen and is positioned between the first bladders, and the second bladders apply pressure to the polishing belt. The pressures of the bladders are individually controlled by pressure controllers. Various pressures are individually applied different portions of the polishing belt by the bladders.
申请公布号 US7431634(B2) 申请公布日期 2008.10.07
申请号 US20070702854 申请日期 2007.02.06
申请人 SAMSUNG ELECTRONICS, CO., LTD. 发明人 LEE YOUNG-CHUL
分类号 B24B49/16 主分类号 B24B49/16
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