| 发明名称 |
Wire bonding apparatus |
| 摘要 |
A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. |
| 申请公布号 |
US7431192(B2) |
申请公布日期 |
2008.10.07 |
| 申请号 |
US20050164980 |
申请日期 |
2005.12.13 |
| 申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
SADLER RICHARD DEWARD |
| 分类号 |
B23K37/00;B23K31/00;B23K31/02 |
主分类号 |
B23K37/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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