| 摘要 |
PROBLEM TO BE SOLVED: To solve problems wherein when cutting scribe lines on which a plurality of marks are provided using a blade, part of marks remains because most part of each mark is deleted by the cutting, an adhesive area between the ground of the mark and residual part of the mark becomes small after dicing, so that adhesive force is lowered, and the mark having a poor adhesive force falls off and is rolled up by an external stress, for example a pressure of a cutting liquid, exerted at dicing. SOLUTION: Neither roll-up nor fall-off of the mark occurs after cutting by not separating films on the upper layer face, such as a protection film and polyimide film, when the mark provided on the scribe line is cut by dicing or by giving a mark width of a size securing a sufficient contact area, even when it is separated. COPYRIGHT: (C)2008,JPO&INPIT
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