| 摘要 |
PROBLEM TO BE SOLVED: To readily mount a heat dissipation device on a heating element such as a semiconductor device. SOLUTION: A first heat dissipation device 1a is mounted on a first heating element 10a by holding the first heating element 10a by the first heat dissipation device 1a by using elasticity of the first heat dissipation 1a molding a heat conductive material. The heat dissipation device has: a curved connection part 2a with elasticity; a first plate part 3a in connection with one end of the connection part 2a; and a second plate part 4a in connection with the other end of the connection part 2a, and holds the first heating element between the first plate part 3a and the second plate part 4a by using elasticity of the connection part 2a. A fin-like part 7a for heat dissipation is connected to the first plate part 3a. The heat conductive material is a resin containing a heat conductive substance. COPYRIGHT: (C)2008,JPO&INPIT
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