| 摘要 |
A positive type photosensitive resin composition for forming patterned resin film is provided. The patterned resin film has high transparency, low dielectric constant, high solvent resistance, high water resistance, high acid resistance, high alkali resistance, high heat resistance, and excellent adhesive properties with the substrate, which is obtained by developing with an alkali solution. The positive type photosensitive resin composition contains copolymer of compound of formula (I) and 1,2-quinonediazido compound, or further mixes with other alkali-soluble polymers, in formula (I), R<SUP>1 </SUP>is hydrogen or allyl group having 1-5 carbon atoms in which any hydrogen may be replaced by fluorine; and R<SUP>2</SUP>, R<SUP>3 </SUP>and R<SUP>4 </SUP>are independently hydroxyl group, alkyl group having 1-5 carbon atoms, alkoxyl group having 1-5 carbon atoms or -O(Si(C<SUB>l</SUB>H<SUB>2l+1</SUB>)<SUB>2</SUB>O)<SUB>m </SUB>Si(C<SUB>p</SUB>H<SUB>2p+1</SUB>)<SUB>3</SUB>, 1 is an integer of 1-5, m is 0 or an integer of 1-10, n is an integer of 1-5, and p is an integer of 1-5.
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