PROCESS FOR PRODUCING PHOTOSENSITIVE RESIN, PHOTOSENSITIVE RESIN OBTAINED BY THE PROCESS, AND PHOTOSENSITIVE RESIN COMPOSITION

摘要

A process for producing a photosensitive resin which is capable of exposure to ultraviolet and development with a dilute aqueous alkali solution, has high sensitivity, is satisfactory in thermal stability and development control tolerance, and is suitable for use as a solder resist ink giving a coating film having excellent performances; a photoresist resin obtained by the production process; and a composition containing the photosensitive resin. The process for photosensitive resin production comprises reacting a novolak type polyfunctional epoxy resin with an unsaturated monobasic acid and a saturated monobasic acid having a primary alcoholic hydroxy group in the presence of an organic compound of trivalent phosphorus and a specific metal salt catalyst to obtain a resin (reaction product I), reacting the resin with a polybasic acid anhydride, and reacting the resultant resin (reaction product II) with a compound having a radical-polymerizable unsaturated group and an epoxy group and a water-soluble monoepoxy compound.