发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
<p>A substrate processing apparatus is provided with a substrate processing container (30) having a chamber inside for storing a substrate (W) to be processed; a first transfer unit (40) which receives and transfers the substrate (W) to the substrate processing container (30); and a second transfer unit which receives and transfers the substrate (W) to the first transfer unit (40) and receives the substrate (W) from the first transfer unit (40). The first transfer unit (40) is of noncontact type and holds the substrate (W) from above without being in contact with the upper surface of the substrate (W). The second transfer unit is of contact type and holds the substrate (W) by being in contact with the substrate (W).</p> |
申请公布号 |
WO2008102603(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
WO2008JP51153 |
申请日期 |
2008.01.28 |
申请人 |
TOKYO ELECTRON LIMITED;KAMIKAWA, YUJI |
发明人 |
KAMIKAWA, YUJI |
分类号 |
H01L21/304;H01L21/677 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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