发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>A substrate processing apparatus is provided with a substrate processing container (30) having a chamber inside for storing a substrate (W) to be processed; a first transfer unit (40) which receives and transfers the substrate (W) to the substrate processing container (30); and a second transfer unit which receives and transfers the substrate (W) to the first transfer unit (40) and receives the substrate (W) from the first transfer unit (40). The first transfer unit (40) is of noncontact type and holds the substrate (W) from above without being in contact with the upper surface of the substrate (W). The second transfer unit is of contact type and holds the substrate (W) by being in contact with the substrate (W).</p>
申请公布号 WO2008102603(A1) 申请公布日期 2008.08.28
申请号 WO2008JP51153 申请日期 2008.01.28
申请人 TOKYO ELECTRON LIMITED;KAMIKAWA, YUJI 发明人 KAMIKAWA, YUJI
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
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