| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a mask for vapor deposition capable of reducing the film deposition cost when using the mask for vapor deposition wherein chips on which mask openings are formed are bonded onto a supporting substrate, and the mask for vapor deposition suitable for carrying out the manufacturing method. SOLUTION: The mask for vapor deposition 10 has a structure wherein a plurality of chips 20 are attached to the rectangular supporting substrate 30 composing a base substrate, provided that irregularities 28a are formed on bonded surfaces 28 of the chip side. This prevents strong adhesion of the chips 20 onto the supporting substrate 30 at parts not bonded with an adhesive, even when the mask for vapor deposition 10 is subjected to a wet process. Thus, the chips 20 can be easily removed from the supporting substrate 30 to recover the supporting substrate 30, and the recovered supporting substrate 30 can be reused to manufacture another mask for vapor deposition 10. COPYRIGHT: (C)2008,JPO&INPIT
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