发明名称 PATTERN FORMING METHOD
摘要 In a pattern forming method of forming a desired pattern on a resist film on a substrate, the surface of a substrate is subjected to a surface hydrophobizing process to form a processed film for improving the adhesion of the surface of the substrate to resist, a coating film including at least a resist film is formed on the processed film, the resist film is exposed to form a desired pattern, and the pattern-formed resist film is developed. In addition to this, the processed film formed on the underside of the substrate by the surface hydrophobizing process is removed between the time from the formation of the processed film and the exposure of the resist film.
申请公布号 US2008204677(A1) 申请公布日期 2008.08.28
申请号 US20080037492 申请日期 2008.02.26
申请人 ITO SHINICHI 发明人 ITO SHINICHI
分类号 G03B27/52;G03F7/26 主分类号 G03B27/52
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