PACKAGE TYPE PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING PACKAGE TYPE PIEZOELECTRIC VIBRATOR

摘要

Provided is a package type piezoelectric vibrator which is capable of being packaged at a wafer level and is suitable for mass production. The package type crystalline vibrator has a structure wherein an extraction electrode exists by having an extraction electrode adhered between a step surface and a lower surface of a frame section of a piezoelectric substrate when a base body is bonded on a lower surface side of the piezoelectric substrate, and a space of a recessed section of the base body is hermetically sealed. Therefore, the piezoelectric substrate can be hermetically sealed easily and the manufacture process is prevented from being complicated, only by bonding a case body on the upper surface side of the piezoelectric substrate and bonding the base body on the lower surface side of the dielectric substrate.