FLUX DOTTING DEVICE OF BALL MOUNTING SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGES

摘要

A flux depositing apparatus of a ball mounting system for fabricating a semiconductor package is provided to deposit flux on a precise position of a bonding pad by depositing flux on a strip several times and by re-arranging the position of the strip with respect to the center of movable blocks in each deposition process. A base block(11) is installed on the main body of a ball mounting system, capable of transferring in an arbitrary direction. A plurality of movable blocks(14,15) are installed under the base block, capable of transferring vertically and independently. A plurality of flux pins(16) for depositing flux on each bonding pad(P) of a strip(S) are formed under each movable block. An elevation driving unit vertically elevates each movable block with respect to the base block. A buffer unit(19a) can reduce the impact applied to the movable block when each movable block is elevated.