| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress unwanted electromagnetic radiation noise from an integrated circuit on the upper surface side of a silicon substrate to the outside or vice versa, in a semiconductor device which is called as CSP. <P>SOLUTION: A sealing film 10 is formed of such material as soft magnetic powder 10b mixed with a thermo-setting resin 10a. Thanks to the soft magnetic powder 10b in the sealing film 10, unwanted electromagnetic radiation noise from the upper surface side of the silicon substrate 1 to the outside or vice versa is suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
