DEVICE AND METHOD FOR MEASURING HEIGHT OF PROJECTION OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a device and method for measuring height capable of accurately measuring the height of a projection object on the surface of an object to be inspected representative of a bump or the like of a bump wafer regardless of the state of the upper face of the projection object.

SOLUTION: The device for measuring the height of the projection object of the surface of the object to be inspected includes: an irradiation optical system for irradiating the bump wafer 1 with irradiation light; a detection optical system for detecting reflection light from the bump wafer 1; a bump measuring region setting part 73 for setting a bump height measuring region 802 to the bump 88 of a measuring object based on bump arrangement information 801 on the bump wafer 1; a statistic processing part 74 for calculating a movement average value 902 by averaging height data 703 of a movement average calculation region 901 in the bump height measuring region 802; a contour line calculation part 75 for calculating a contour line 904 of a cross section of the bump 88 based on the movement average value 902; and a bump height determining part 76 for determining a peak value of the contour line 904 as bump height.

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