| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable visual observation of the flowing conditions of an underfill agent in the step of mounting a chip, namely observation of behaviors of voids, in a method for manufacturing observation apparatus and electronic apparatus for electronic component to which underfill agent is provided. <P>SOLUTION: The observation apparatus is provided to observe generation of voids 13 in the underfill agent 12 at flip-chip mounting of a glass chip 4 to a glass substrate 5 via the underfill agent 12. This observation apparatus includes a mounting means (attracting head 8, a mounting stage 10, a head moving mechanism 27, a pressure adjusting mechanism 30 and a stage moving device 40) for mounting the glass chip 4 to the glass substrate 5, and an observation means (imaging camera 23, lens unit 24) for observing behaviors of the underfill agent 12 during the mounting process. <P>COPYRIGHT: (C)2008,JPO&INPIT |
