| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition which cures with high sensitivity upon exposure and can form a proper pattern with high adhesion to a material surface in a cured area and superior removability of an uncured portion in an uncured region. <P>SOLUTION: The curable composition contains a resin, a compound containing an ethylenically unsaturated double bond and a photopolymerization initiator, wherein the resin is manufactured, by polymerizing at least a monomer that has a dipole moment of 2.0 or larger as copolymerization component. <P>COPYRIGHT: (C)2008,JPO&INPIT |
