WIRING CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of sufficiently improving the strength of a terminal formed as a flying lead, and to provide a method of manufacturing the same.

SOLUTION: The manufacturing method has a step of preparing a metal supporting substrate 2; a step of forming a base insulating layer 3 thereon; a step of forming a conductor pattern 4 having a terminal 11 and formed of copper thereon; a step of forming a tin layer 21 on the upper surface and each of side surfaces of the conductor pattern 4; a step of coating the conductor pattern 4 on the base insulating layer 3; and a step of forming a cover coating 23 so that the tin layer 21 on the terminal 11 is exposed. The manufacturing method further has a step of heating the conductor pattern 4 and the tin layer 21 to form a tin copper alloy layer 5 formed by dispersing tin in copper on the upper surface and each of the side surfaces of the conductor pattern 4; a step of curing the cover coating 23 to form a cover insulating layer 6; and a step of forming a metal opening 8 and a base opening 9 at the metal supporting substrate 2 and the base insulating layer 3 so that the lower surface of the terminal 11 is exposed.

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