| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in the balance between fluidity, releasability and continuously molding property when molding and sealing a semiconductor element, and having excellent solder resistance. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing promoter, (D) an inorganic filler, (E) a butadiene-acrylonitrile copolymer having carboxy and (F) a silicone oil containing at least one organic group having a polycaprolactone group, wherein the epoxy resin composition comprises the (E) component of≥0.01 wt.% and≤1 wt.% in the whole epoxy resin composition and the (F) component of≥0.01 wt.% and≤3 wt.% in the whole epoxy resin composition. COPYRIGHT: (C)2008,JPO&INPIT |
