发明名称 INTEGRATION CIRCUITS FOR REDUCING ELECTROMIGRATION EFFECT
摘要 An integrated circuit for reducing the electromigration effect. The IC includes a substrate and a power transistor which has first and second source/drain regions. The IC further includes first, second, and third electrically conductive line segments being (i) directly above the first source/drain region and (ii) electrically coupled to the first source/drain region through first contact regions and second contact regions, respectively. The first and second electrically conductive line segments (i) reside in a first interconnect layer of the integrated circuit and (ii) run in the reference direction. The IC further includes an electrically conductive line being (i) directly above the first source/drain region, (ii) electrically coupled to the first and second electrically conductive line segments through a first via and a second via, respectively, (iii) resides in a second interconnect layer of the integrated circuit, and (iv) runs in the reference direction.
申请公布号 US2008203495(A1) 申请公布日期 2008.08.28
申请号 US20070680081 申请日期 2007.02.28
申请人 发明人 STAMPER ANTHONY KENDALL;SULLIVAN TIMOTHY DOOLING;WANG PING-CHUAN
分类号 H01L29/772 主分类号 H01L29/772
代理机构 代理人
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