发明名称 PLASMA PROCESSING EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide plasma processing equipment capable of efficiently performing plasma processing. <P>SOLUTION: The plasma processing equipment 1 comprises an application electrode 2, a palette (first electrode) 4 where a work 100 is mounted and a function as the opposite electrode of the application electrode 2 is provided together, a gas supply means 11 for supplying a gas for plasma processing, and a first circuit (power supply part) 8 for applying a voltage between the application electrode 2 and the palette 4. On the lower surface 63 of a table 6 for mounting the palette 4, a vibrator 9 is disposed. The plasma processing equipment 1 is provided with a distance detection means 53 for detecting a separation distance L between the surface 110 to be processed of the work 100 and an opposite surface 30, a moving means 5 for stipulating the separation distance L, and a control means 70 for controlling the operation of the moving means 5. When processing the surface 110 to be processed while integrally vibrating the palette 4 and the work 100 by the vibrator 9, the moving means 5 is operated by the control means 70. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008198894(A) 申请公布日期 2008.08.28
申请号 JP20070034389 申请日期 2007.02.15
申请人 SEIKO EPSON CORP 发明人 SATO MITSURU
分类号 H01L21/3065;B08B7/00;C23C16/509;C23C16/52;H05H1/24 主分类号 H01L21/3065
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