发明名称 DILUTABLE CMP COMPOSITION CONTAINING A SURFACTANT
摘要 The inventive polishing composition comprises an abrasive, an aqueous medium, a surfactant in an amount above its critical micelle concentration, and a hydrophobic surface active compound. The invention also provides a method of using a polishing composition.
申请公布号 US2008203059(A1) 申请公布日期 2008.08.28
申请号 US20070679273 申请日期 2007.02.27
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 DE REGE THESAURO FRANCESCO;KELEHER JASON
分类号 B44C1/22 主分类号 B44C1/22
代理机构 代理人
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