| 发明名称 |
Using Spectra to Determine Polishing Endpoints |
| 摘要 |
Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described. |
| 申请公布号 |
US2008206993(A1) |
申请公布日期 |
2008.08.28 |
| 申请号 |
US20080036174 |
申请日期 |
2008.02.22 |
| 申请人 |
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发明人 |
LEE HARRY Q.;SWEDEK BOGUSLAW A.;BENVEGNU DOMINIC J.;DAVID JEFFREY DRUE |
| 分类号 |
H01L21/461;B24B49/00;G06F19/00 |
主分类号 |
H01L21/461 |
| 代理机构 |
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代理人 |
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| 地址 |
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