发明名称 |
Verfahren und Vorrichtung zum chemisch-mechanischen Polieren |
摘要 |
A polishing device (16) is hermetically accommodated in a chamber (13) containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device (16) is altered into the composition different from the ambient air, and voltage is applied between a wafer (W) and a polishing pad (34a) to polish the wafer (W) with an electrolytic effect. The polishing device (16) has the atmosphere containing extremely less oxygen, preventing a surface of the wafer (W) from oxidation and thereby providing a constant polishing rate. <IMAGE> |
申请公布号 |
DE60322144(D1) |
申请公布日期 |
2008.08.28 |
申请号 |
DE2003622144 |
申请日期 |
2003.05.16 |
申请人 |
TOKYO SEIMITSU CO. LTD.;DOI, TOSHIRO |
发明人 |
DOI, TOSHIRO;FUJITA, TAKASHI |
分类号 |
B24B37/00;B24B37/04;B23H5/06;C25F3/30;H01L21/304;H01L21/306 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|