发明名称 EPOXY RESIN COMPOSITION FOR IMPREGNATING MOLDED COIL, AND MOLDED COIL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent mechanical strength, a dielectric breakdown voltage kept high not only in the initial stage but also in an energized state, and excellent ability for impregnating the coil, and to provide a molded coil device using the epoxy resin composition. SOLUTION: The epoxy resin composition for impregnating the molded coil contains (A) an epoxy resin, (B) silica particles, (C) an acid anhydride and (D) a curing accelerator as essential components, wherein the content of the silica particles having 10-30μm average particle diameter as the silica particles (B) is 30-85 mass% based on the epoxy resin composition. The molded coil device is obtained by using the composition. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008195782(A) 申请公布日期 2008.08.28
申请号 JP20070030820 申请日期 2007.02.09
申请人 KYOCERA CHEMICAL CORP 发明人 KAYAMORI TAKANARI;UCHIDA NOBUHIKO;NAKAMI HIROAKI
分类号 C08L63/00;C08G59/42;C08K3/22;C08K3/36;C08K9/06;H01F27/32;H01F41/12 主分类号 C08L63/00
代理机构 代理人
主权项
地址