| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficiently excellent adhesion property and heat-resistance in the ordinary state, capable of achieving sufficient flame-retardancy and maintaining the sufficient excellent adhesion property and heat-resistance even after being allowed to stand under a high temperature or a high temperature/high humidity environment. SOLUTION: The adhesive composition comprises a modified polyamideimide resin prepared by reacting a diimide dicarboxylic acid mixture containing the diimide dicarboxylic acid represented by the following general formula (1a) or (1b), the diimididicarboxylic acid represented by the following general formula (1c) and the diimide dicarboxylic acid represented by the following general formula (1d) with an aromatic diisocyanate, a thermosetting resin, and an organic phosphorous compound. COPYRIGHT: (C)2008,JPO&INPIT
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