发明名称 METHOD FOR TESTING NANO-IMPRINT LITHOGRAPHY MOLD AND METHOD FOR REMOVING RESIN RESIDUE
摘要 PROBLEM TO BE SOLVED: To test and remove the residue of a thermosetting resin or photocurable resin of a nano-imprint lithography mold. SOLUTION: The residue 4 of the thermosetting resin or the photocurable resin adherent to the mold 3 is detected by comparing the three-dimensional shape 1 of the mold measured by an AFM during the manufacturing of the mold or three-dimensional CAD design data of the mold with the transferred three-dimensional shape 2 of the mold measured by the AFM. The accuracy of residue detection is improved by carrying out high-fidelity observation with a probe with a thin diameter and a high aspect or improving the shape of the probe. The extracted residue is removed by physical removal by an AFM probe, electron beam gas assist etching, or focused ion beam gas assist etching to make the mold reusable. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008194838(A) 申请公布日期 2008.08.28
申请号 JP20070029411 申请日期 2007.02.08
申请人 SII NANOTECHNOLOGY INC 发明人 TAKAOKA OSAMU
分类号 B29C59/02;H01L21/027 主分类号 B29C59/02
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