| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooler that has excellent cooling efficiency and can be miniaturized easily, and to provide a power converter using the cooler. SOLUTION: The cooler 3 has a plurality of cooling pipes 31 arranged so that an electronic component (semiconductor module 2) is clamped from both surfaces. The power converter 1 uses the cooler 3. The cooling pipes 31 have a refrigerant channel 33 divided into not less than three layers by a partition wall 34 in a lamination direction to the semiconductor module 2. On the partition wall 34 between the outermost and innermost refrigerant channels 332, 331 in the refrigerant channels 33, there is a jet hole 35 for jetting a cooling refrigerant to the outermost cooling channel 332 from the innermost one 331. COPYRIGHT: (C)2008,JPO&INPIT |
