发明名称 |
ELECTRONIC COMPONENT STRUCTURE AND METHOD OF MAKING |
摘要 |
An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.
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申请公布号 |
US2008206927(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20070752181 |
申请日期 |
2007.05.22 |
申请人 |
GRAYDON BHRET;SHU WILLIAM KUANG-HUE |
发明人 |
GRAYDON BHRET;SHU WILLIAM KUANG-HUE |
分类号 |
H01L21/58 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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