发明名称 |
Apparatus And Method For Manufacturing Stress-Free Flexible Printed Circuit Board |
摘要 |
An apparatus and method for manufacturing a highly efficient flexible thin metal film-laminated strip by improves adhesiveness between a polyimide strip and a thin metal film, and removes stress from thin films laminated through magnetron sputtering, which is a dry deposition process. The stress-free flexible circuit board manufacturing method includes the steps of: a) depositing a seed layer on the substrate using the magnetron deposition source; b) depositing a compressive thin film using the single magnetron deposition source arranged next to the magnetron deposition source; c) depositing tensile thin film using the dual magnetron deposition source arranged next to the single magnetron deposition source; and d) repeating the steps b) and c) so as to sequentially and alternately deposit compressive thin films and tensile thin films thereby obtaining a thick film with a desired thickness.
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申请公布号 |
US2008202919(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20080034707 |
申请日期 |
2008.02.21 |
申请人 |
HAN JEON GEON;KIM KAB SEOG;KIM YONG MO |
发明人 |
HAN JEON GEON;KIM KAB SEOG;KIM YONG MO |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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