发明名称 Manufacturing method of semiconductor device
摘要 To create a laminated film of a silicon oxide film and a silicon nitride film, with large current driving force and large dielectric constant. A manufacturing method of a semiconductor device includes: forming an amorphous silicon film on the silicon oxide film; and forming a single crystal silicon film by annealing the amorphous silicon film.
申请公布号 US2008206968(A1) 申请公布日期 2008.08.28
申请号 US20070987893 申请日期 2007.12.05
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 OGAWA UNRYU
分类号 H01L21/203 主分类号 H01L21/203
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