PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS OF MAKING SAME

摘要

A device is disclosed which includes a flexible material (201) including at least one conductive wiring trace, a first die (300) including at least an integrated circuit, the first die (300) being positioned above a portion of the flexible material (201), and an encapsulant material (360) that covers the first die (300) and at least a portion of the flexible material (201). A method is disclosed which includes positioning a first die (300) above a portion of a flexible material (201), the first die (300) including an integrated circuit and the flexible material (201) including at least one conductive wiring trace, and forming an encapsulant material (360) that covers the first die (300) and at least a portion of the flexible material (201), wherein at least a portion of the flexible material (201) extends beyond the encapsulant material (360).