发明名称 |
BENDING DEVICE AND BENDING METHOD |
摘要 |
<p>A bending device (1) is provided for bending a work (object to be processed) by using a bending die (2) formed in accordance with the curved profile of the work, and a linear die (3) extended linearly. The bending device comprises a table (10) having a work plane (11a) for mounting the bending die (2) and the linear die (3), and a pair of rollers (40, 50) moving along the work plane (11a). The rollers (40, 50) are arranged to move from one end side toward the other end side of the bending die (2) and the linear die (3) while clamping the bending die (2) and the linear die (3) from the mold clamping direction. With such an arrangement, thebending device (1) can be constituted in small sizes, the work space required for bending work can be reduced and the efficiency of bending work can be enhanced.</p> |
申请公布号 |
WO2008102430(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
WO2007JP53022 |
申请日期 |
2007.02.20 |
申请人 |
SEIKO WORKS, LTD.;SHIOYA, SUSUMU;NAKAMURA, KOUICHI |
发明人 |
SHIOYA, SUSUMU;NAKAMURA, KOUICHI |
分类号 |
B21D7/025 |
主分类号 |
B21D7/025 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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