| 摘要 |
PROBLEM TO BE SOLVED: To reduce the deformation of a rigid substrate after resin is sealed and the deformation of a semiconductor element when resin is sealed by improving the rigid substrate and a resin sealing metal mold in a manufacturing method of a resin sealing-type semiconductor device using the rigid substrate. SOLUTION: The manufacturing method of the semiconductor device comprises a process for installing a notch in a lower metal mold opposing the substrate end of a part sandwiched between an upper metal mold and the lower metal mold on the bent side of the metal mold, a process for arranging the rigid substrate on the metal mold and a process for pouring resin into a space between the upper metal mold of the metal mold and the rigid substrate and resin-sealing the semiconductor element. COPYRIGHT: (C)2008,JPO&INPIT
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