发明名称 METHOD FOR FORMING METAL FILM AND METAL FILM OBTAINED BY THE METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a metal film whose electric resistance is remarkably reduced compared with the case where a film is formed only by a heat treatment. SOLUTION: The method for forming a metal film comprises: a stage where the surface of a base material is coated with a metal colloid in which metal colloid particles are composed of metal particles and a protective agent coordinated on the surfaces of particles for modification, wherein the protective agent has a carbon skeleton comprising either or both of nitrogen and oxygen in the molecule, and also has a structure of being coordinated on the surfaces of the metal particles for modification with one or more kinds selected from the group consisting of nitrogen, oxygen, a nitrogen-containing atomic group and an oxygen-containing atomic group as an anchor, and has a hydroxyalkyl group in the molecular structure, and obtained by mixing the metal colloid particles at a prescribed ratio into either dispersion medium of a water system or a non-water system or a dispersion medium prepared by mixing them, so as to be dispersed; a stage where the dispersion medium in the coated metal colloid is removed by natural drying of a base material; and a stage where the base material is maintained to have from a room temperature to 200°C and irradiates ozone of 5 to 200 g/Nm<SP>3</SP>, thus a metal film is formed on the surface of the base material. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008199003(A) 申请公布日期 2008.08.28
申请号 JP20080009327 申请日期 2008.01.18
申请人 MITSUBISHI MATERIALS CORP 发明人 IZUMI REIKO;HAYASHI TOSHIHARU
分类号 H01L21/288;B05D7/24;C09C1/00;C09C3/08;C23C20/04;H01B13/00 主分类号 H01L21/288
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