发明名称 PATTERN FORMING METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING THE ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a surface processing method with a low cost to reduce the cost necessary for trial manufacture, etc. of an electronic device. SOLUTION: An apparatus for manufacturing an electronic device includes: a vacuum processing chamber 402 which contains an energy beam irradiating means 412, a gas exhausting means, and a substrate holding means 418 for holding a substrate 10; a liquid material supply chamber 404, which includes a gas supplying means, a gas exhausting means, a substrate holding means 418 for holding a substrate 10, and a liquid material supplying means 422 for supplying a liquid material onto the substrate 10 held by the substrate holding means 418; a transfer passage for communication between the vacuum processing chamber 402 and the liquid material supply chamber 404; a gate valve for opening or closing the passage, a means 436 for transporting the substrate 10 between the vacuum processing chamber 402 and the liquid material supply chamber 404; and a substrate transfer entrance 438 for communicating with at least one of the vacuum processing chamber and the liquid material processing chamber. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008198822(A) 申请公布日期 2008.08.28
申请号 JP20070033111 申请日期 2007.02.14
申请人 SEIKO EPSON CORP 发明人 TANAKA HIDEKI
分类号 H01L21/20;C23C16/48;H01L21/02;H01L21/285;H01L21/336;H01L29/786 主分类号 H01L21/20
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