发明名称 Module Board
摘要 A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.
申请公布号 US2008205016(A1) 申请公布日期 2008.08.28
申请号 US20060908726 申请日期 2006.03.15
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAKATORI MASAHIRO;ISHIMARU YUKIHIRO
分类号 H05K1/14 主分类号 H05K1/14
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