发明名称 |
APPARATUS FOR MOUNTING COMPONENT |
摘要 |
<p>APPARATUS AND METHOD FOR MOUNTING COMPONENT A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at the component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted on a substrate such as circuit board. The component held by the placement head is recognized by an imaging device at or in the vicinity of the transfer station:.</p> |
申请公布号 |
SG144725(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
SG20040058913 |
申请日期 |
2001.03.23 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
UENO YASUHARU;MINAMITANI SHOZO;KANAYAMA SHINJI;SHIMIZU TAKASHI;SIDA SATOSHI;ONOBORI SHUNJI |
分类号 |
H01L21/60;H05K13/04;H05K13/08;(IPC1-7):H05K13/04 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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