| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition ensuring adequate developability and forming an image with good resolution in a thick film while using a polyimide resin precursor. <P>SOLUTION: The photosensitive resin composition comprises (A) an alkali-soluble polyamic acid having a structure represented by general formula (1), (B) a photopolymerizable compound having an ethylenically unsaturated group in a molecule, (C) a photopolymerization initiator comprising a hexaarylbiimidazole compound, and (D) a sensitizing dye having an absorption maximum wavelength in a wavelength range of 370-410 nm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
