| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method to manufacture an epoxy resin composition for sealing an optical semiconductor element that allows uniform dispersion of phosphor powder in order to obtain a desired stable white LED. <P>SOLUTION: Phosphor powder, having a primary particle average size of 1-10 μm, is mixed and dispersed into a liquid epoxy resin, whose viscosity at 25°C is 8-12 Pas, so as to adjust a liquid epoxy resin in which phosphor powder, having an average particle size of 1-10 μm, is dispersed. Next, at least a transparent epoxy resin (an A component) and a curing agent (a B component) are blended and melt-mixed with each other together with the liquid epoxy resin, in which the phosphor powder is dispersed, so as to manufacture an epoxy resin composition for sealing an optical semiconductor element. <P>COPYRIGHT: (C)2008,JPO&INPIT |
