| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a peeling between a molding resin and a terminal section in the mating surface of the molding resin and the terminal section while preventing a slipping-off from the molding resin of the terminal section. SOLUTION: In a resin seal type semiconductor device 10, a hook section 30 projected in the board thickness direction of the terminal section 26 is formed to a section molded of the molding resin 20 of the terminal section 26. Accordingly, even when the molding resin 20 is expanded and contracted by a heat and a stress is generated in the molding resin 20 as a result of expansion and contraction, the occurrence of the peeling between the molding resin 20 and the terminal section 26 in the mating surface of the molding resin 20 and the terminal section 26 can be prevented while slipping-off from the molding resin 20 of the terminal section 26 can also be prevented by a hook effect owing to the hook section 30. COPYRIGHT: (C)2008,JPO&INPIT |
