发明名称 RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin molding apparatus capable of selectively heating a thermoplastic resin in the cavity in comparison with a rubber-made molding die and restraining the deformation of the molding die and to provide a resin molding method. SOLUTION: The resin molding apparatus 1 has the rubber-made molding die 2, the electromagnetic wave generating means 4 that emits the electromagnetic wave having wavelengths of 0.78-4μm, the glass-made filter 52 for reducing the penetration amount of the electromagnetic wave that exceeds 2μm in wavelength and the rubber-made filter 51 that absorbs the electromagnetic wave of the wavelength region absorbed in the molding die 2 out of the electromagnetic wave that penetrates the glass-made filter 52. In packing the molten thermoplastic resin 3 into the cavity 21 the resin molding apparatus 1 allows the electromagnetic wave emitted from the electromagnetic wave generating means 4 to penetrate the glass-made filter 52 and the rubber-made filter 51, irradiates the penetrating electromagnetic wave, which has been allowed to penetrate the glass-made filter 52 and the rubber-made filter 51, onto the thermoplastic resin 3 through the molding die 2, and heats the thermoplastic resin 3 to a temperature higher than that of the molding die 2. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008194910(A) 申请公布日期 2008.08.28
申请号 JP20070031405 申请日期 2007.02.12
申请人 TECHNO POLYMER CO LTD;NIPPON REKKUSU KK 发明人 KURIHARA FUMIO;TAKAMI MASAMITSU;ABE KOICHI
分类号 B29C39/22;B29C33/02;B29C33/40;B29C39/02;B29K101/12 主分类号 B29C39/22
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