| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having the soldering crack resistance sufficient for keeping up with the rise of reflow treating temperature by keeping up with lead-free soldering in recent years, without lowering heat resistance, and its cured product and a new phenol resin imparting those performances to the composition. SOLUTION: In the epoxy resin having a molecular structure in which a monoglycidyloxybenzene structure moiety is bonded through a methylene group to an alkoxynaphthalene structural site, the content of a compound having a structure represented by structural formula (1) (wherein either one of X and Y is a methylene group and the other thereof is an oxygen atom; R<SP>1</SP>and R<SP>2</SP>are each independently a hydrogen atom, a glycidyloxy group or a 1-4C alkyl group; R<SP>3</SP>, R<SP>4</SP>and R<SP>5</SP>are each independently a hydrogen atom, a 1-4C alkyl group or an alkoxy group) is≤0.40 mass%. COPYRIGHT: (C)2008,JPO&INPIT
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