| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power converter that has a high degree of freedom in the arrangement of components, and can be miniaturized easily. <P>SOLUTION: The power converter 1 has a plurality of semiconductor modules 2 incorporating a semiconductor element, and a cooler 3 for cooling the semiconductor module 2 from both main surfaces. The cooler 3 has a plurality of cooling pipes 31 arranged on both the main surfaces of the semiconductor module 2, and a connection section 32 for mutually connecting a refrigerant inlet 311 and a refrigerant outlet 312 of the plurality of cooling pipes 31. Both the refrigerant inlet and outlet 311, 312 are concentrated at one region of two regions divided by a center straight line M passing through the geometrical center of gravity at a body section 20 of the semiconductor module 2 in contact with the surface of the cooling pipe 31 in which the refrigerant inlet and outlet 311, 312 are formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
