| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in solder heat resistance and excellent in balance between mold release properties in molding, continuous moldability, surface appearance of a cured resin article, contamination of mold, etc., and to provide a semiconductor device. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenolic resin-based handener, (C) an organopolysiloxane (c1) having a polycaprolactone group, and/or a reaction product (c2) of the organopolysiloxane having a polycaprolactone group (c1) with an epoxy resin, and (D) an organopolysiloxane represented by general formula (1). COPYRIGHT: (C)2008,JPO&INPIT |
