| 摘要 |
A first pad has first and second sub-pads that are connected to each other by a connection section extending in a manner overlapping with a mounted circuit chip and that are connected to two terminals formed at two positions on a diagonal of a lower surface of the circuit chip, respectively. The second pad has third and fourth sub-pads that are connected to each other via a route bypassing the mounted circuit chip and that are connected to two terminals formed at two positions on the other diagonal of the lower surface of the circuit chip, respectively.
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