发明名称 |
PIEZOELECTRIC PACKAGE WITH POROUS CONDUCTIVE LAYERS |
摘要 |
A piezoelectric package comprises a piezoelectric plate having a first planar surface and a second planar surface that are electrically isolated from each other. The piezoelectric package further comprises a first electrically conductive layer electrically coupled to the first planar surface, and a second electrically conductive layer electrically coupled to the second planar surface. The piezoelectric package further comprises a first electrically insulative material (e.g., a rigid fiber composite material) encapsulating the piezoelectric plate and at least portions of the first and second electrically conductive layers.
|
申请公布号 |
US2008203851(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20080038787 |
申请日期 |
2008.02.27 |
申请人 |
IPTRADE, INC. |
发明人 |
PLETNER BARUCH;KESSENICH GRACE R. |
分类号 |
H01L41/04;H01L41/053;H01L41/083;H01L41/09;H01L41/113 |
主分类号 |
H01L41/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|