发明名称 CONNECTION OF WIRE TO A LEAD FRAME
摘要 An integrated circuit includes a first lead frame and a second lead frame that extend from an overmolded circuit assembly. Each of the lead frames includes a piercing portion to pierce through insulation on a corresponding electrical conduit. The piercing portion of the lead frames also provides a wrap around feature to mechanically secure the wire to the corresponding electrical conduit. In this manner, several processes can be eliminated and are not required for the desired mechanical and electrical connection of the integrated circuit lead frame to corresponding electrical conductors.
申请公布号 US2008205020(A1) 申请公布日期 2008.08.28
申请号 US20070939070 申请日期 2007.11.13
申请人 SIEMENS VDO AUTOMOTIVE CORPORATION 发明人 VICH GAETAN
分类号 H05K7/02;H05K7/18;H05K13/04 主分类号 H05K7/02
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