| 摘要 |
PROBLEM TO BE SOLVED: To automatically peel a tape for preventing leakage of a resin for packaging from a lead frame. SOLUTION: A lead frame LF consists of a frame material comprising a main surface on which a semiconductor chip is mounted and a rear surface to which a tape PT is pasted. It comprises a plurality of leads LD at a mounting part DP where a semiconductor chip is mounted and its vicinity, and a notch CP cut out of the edge of the frame material. A part of the tape PT is peeled from the main surface side of the lead frame LF to the rear surface side by moving a tab-like jig through the notch CP, and then the entire tape PT is peeled using the peeled tape. COPYRIGHT: (C)2008,JPO&INPIT
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