| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum treatment device where the surface of a substrate can be uniformly treated. <P>SOLUTION: The vacuum treatment device 10 comprises: a vacuum tank 11; and a substrate holder 30 arranged at the inside of the vacuum tank 11. In the mounting face 32 of the substrate holder 30, a suction port 34 is formed at a position confronted with a mask 20, and when a gas on the suction port 34 is exhausted, the mask 20 is vacuum-sucked, and a substrate 7 is pressed against the substrate holder 30 by the mask 20. The suction port 34 is not formed at the place disposed with the substrate 7 in the mounting face 32, and the substrate 7 is not vacuum-sucked, a bias is not produced in plasma density on the surface of the substrate 7, and the surface of the substrate 7 is uniformly treated by plasma. <P>COPYRIGHT: (C)2008,JPO&INPIT |
