| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-circuit board that suppresses failures due to damage in manufacture, shape defect in a recess, or the like, can be manufactured easily, and has a recess, and to provide a method of manufacturing the printed-circuit board. SOLUTION: A metal layer in a core substrate for composing the bottom face of a recess in first and second core substrates is composed in a shape where no parts overlapping with the bottom face of the recess exist in an upper-surface view, thus preventing a part that becomes the bottom face of the recess from coming into contact with a hot plate due to the thickness in the metal layer in lamination press that is a general method when pressure-bonding the area between the substrates by prepreg and hence preventing pressure from being applied to a part equivalent to the bottom face of the recess in the core substrate, thus preventing the bottom face of the recess from being strained due to pressure in compression-bonding (lamination press) and preventing shape fail in the recess from being generated easily due to a strain. COPYRIGHT: (C)2008,JPO&INPIT |
